

| Parameter | Nilai |
|---|---|
| 9.5 mm Tolerance: +1.5 mm (in combination with Article Family:FP 1.27/...-MV 3.25) | |
| Langkah | 1.27 mm |
| nota | Complies with WEEE/RoHS, no thread-like materials according to IEC 60068-2-82/JEDEC JESD 201 |
| Keputusan | Test passed |
| Proses | Reflow soldering |
| Amplitud | 1.5 mm (10 Hz ... 60.1 Hz) |
| Tahap ESD | (D) Anti-static |
| Kekerapan | 10 - 2000 - 10 Hz |
| Pembungkusan | Tape width 72 mm |
| Lebar [l] | 48.27 mm |
| Tinggi [t] | 6.95 mm |
| Panjang [l] | 7.2 mm |
| Susun Atur Pin | Linear Pad Geometry |
| Bentuk Kejutan | Semi-sinusoidal |
| Kelajuan Sapuan | 1 octave/min |
| Pecutan | 20g (60.1 Hz ... 2000 Hz) |
| Warna (Sarung) | Black (9005) |
| Geometri Pad | 0.8 x 1.1 mm |
| Jenis Produk | SMD Socket |
| Voltan ujian | 500 V AC IEC 60512-4-1:2003 |
| Jenis pemasangan | SMD Soldering |
| Ulasan artikel | 00 |
| Lebar tali pinggang [L] | 72 mm |
| Bilangan baris | 2 |
| Keluarga Produk | FR 1.27/...-FV 6.25 |
| Jarak Shank | 1.27 mm |
| Tempoh Kejutan | 11 ms |
| Ketinggian Bertindan | 8 mm Tolerance: +1.5 mm (in combination with Family Item:FP 1.27/...-MV 1.75) |
| Kemasan Permukaan | Selective Coating |
| Bilangan tiang | 68 |
| Arahan Ujian | X, Y, and Z axis |
| Liputan Hubungi | 0.9 mm |
| Bahan Sentuh | Cu Alloy |
| Voltan AC tetap | 500 V AC |
| Kerintangan Jisim | 25 mΩ |
| Bilangan kitaran | 500 |
| Arus Terkadar IN | 1.4 A IEC 60512-5-2:2002-02 (at 20 °C at 50 poles) |
| Toleransi Sudut | ± 4° in longitudinal axis |
| Diameter gegelung [A] | 330 mm |
| Panjang Sambungan | 1.5 mm |
| Jenis pembungkusan | Transparent bag |
| Kitaran manuver | 500 |
| Nota untuk Operasi | The permissible voltage during operation is deduced according to the application by considering creepage and creepage distances within the scope of the insulation requirements according to IEC 60664-1. |
| Spesifikasi Ujian | IEC 60068-2-70:1995-12 |
| Lukisan Berdimensi | |
| Ketinggian Pemasangan | 6.25 mm |
| Bahan penebat | LCP |
| Kerintangan Jisim R1 | 25 mΩ |
| Kerintangan Jisim R2 | 25 mΩ |
| Menggerakkan jarak roda | ± 0.7 mm in longitudinal and transverse axis |
| Bilangan potensi | 68 |
| Bilangan tiang yang diuji | 50 |
| Tempoh ujian setiap gandar | 2.5 h |
| Saiz luaran gegelung [W2] | 78.4 mm |
| Tekanan akibat kakisan | Method 1, 10 days |
| Tahap Sensitif Kelembapan | MSL 1 |
| Kumpulan Bahan Penebat | IIIb |
| CTI mengikut IEC 60112 | 175 |
| Suhu Pengelasan Tc | 260 °C |
| Suhu ambien (pemasangan) | -5 °C ... 100 °C |
| Daya tegangan setiap kutub lebih kurang. | 0.5 N |
| Suhu ambien (operasi) | -55 °C ... 125 °C |
| Daya sisipan setiap tiang lebih kurang. | 0.5 N |
| Suhu ambien (penyimpanan/pengangkutan) | -40 °C ... 70 °C |
| Kelas kebolehbakaran mengikut UL 94 | V0 |
| Tegangan impuls menegak di atas paras laut | 0.8 kV |
| Kawasan sentuhan permukaan logam (lapisan tengah) | Nickel (Ni) Palladium-nickel, (PdNi) |
| Kelembapan relatif (pengangkutan dan penyimpanan) | 30 % ... 70 % |
| Kawasan Kimpalan Permukaan Logam (Lapisan Permukaan) | Pond (Sn) |
| Zon sentuhan permukaan logam (lapisan permukaan) | Gold (Au) |
| Nilai minimum jarak udara dan permukaan | 0.4 mm |
| Rintangan Penebat Antara Kutub Bersebelahan | ≥ 10 GΩ |
Spesifikasi teknikal dan data prestasi
Panduan pemasangan dan operasi