

| Parameter | Nilai |
|---|---|
| 13.5 mm Tolerance: +1,5 mm (in combination with Range of articles:FP 0,8/...-MV 2,65) | |
| Nota | WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 |
| Padang | 0.8 mm |
| Proses | Reflow soldering |
| Tahap ESD | (D) electrostatically conductive |
| Lebar [l] | 36.78 mm |
| Tinggi [t] | 11.45 mm |
| Panjang [l] | 6.9 mm |
| Susun atur pin | Linear pad geometry |
| Panjang lap | 1.5 mm |
| Geometri pad | 0.5 x 3 mm |
| Jenis produk | SMD female connector |
| Ketinggian timbunan | 12 mm Tolerance: +1,5 mm (in combination with Range of articles:FP 0,8/...-MV 1,15) |
| Voltan ujian | 500 V AC IEC 60512-4-1:2003 |
| Ofset tengah | ± 0.7 mm in longitudinal and transverse direction |
| Penutup kenalan | 0.8 mm |
| Jenis pemasangan | SMD soldering |
| Spesifikasi | IEC 60512-5-2:2002-02 |
| Bilangan baris | 2 |
| Keluarga produk | FP 0,8/...-FV 10,85 |
| Lebar pita [W] | 56 mm |
| Warna (Perumahan) | black (9005) |
| Bahan sentuh | Cu alloy |
| Ketinggian yang dipasang | 10.85 mm |
| Toleransi sudut | ± 5 ° in longitudinal and transverse direction (when plugging in) |
| Keratan rentas AWG | (converted acc. to IEC) |
| Jenis pembungkusan | 56 mm wide tape |
| Diameter gegelung [A] | 330 mm |
| Rintangan sentuhan | 20 mΩ |
| Arus nominal IN | 1.7 A IEC 60512-5-2:2002-02 (at 20°C 80-pos.) |
| Nota tentang operasi | The permissible voltage during operation depends on the application, taking into consideration the air clearances and creepage distances within the scope of insulation requirements in accordance with IEC 60664-1. |
| Tahap pencemaran | 3 |
| Lukisan dimensi | |
| Bahan penebat | LCP |
| Bilangan jawatan | 80 |
| Bilangan potensi | 80 |
| Jenis pembungkusan luar | Transparent-Bag |
| Rintangan sentuh R1 | 20 mΩ |
| Rintangan sentuh R2 | 20 mΩ |
| Ciri-ciri permukaan | Selective coating |
| Tahap Sensitif Kelembapan | MSL 1 |
| Kumpulan bahan penebat | IIIb |
| CTI mengikut IEC 60112 | 150 |
| Bilangan jawatan yang diuji | 80 |
| Kitaran pemasukan/penarikan balik | 500 |
| [W2] dimensi keseluruhan gegelung | 62.4 mm |
| Suhu ambien (pemasangan) | -5 °C ... 100 °C |
| Suhu ambien (operasi) | -55 °C ... 125 °C |
| Butiran untuk proses pematerian | The items are suitable for assembly on both sides and for overhead soldering. |
| Kelembapan relatif (penyimpanan/pengangkutan) | 30 % ... 70 % |
| Penarafan mudah terbakar mengikut UL 94 | V0 |
| Kawasan sentuhan permukaan logam (lapisan atas) | Gold (Au) |
| Suhu ambien (penyimpanan/pengangkutan) | -40 °C ... 70 °C |
| Kawasan pematerian permukaan logam (lapisan atas) | Tin (Sn) |
| Ofset aksial dalam arah Y (melintang) | ± 0.3 mm (Tolerance compensation when plugged in) |
| Kawasan sentuhan permukaan logam (lapisan tengah) | Nickel (Ni) |
| Ofset aksial dalam arah X (longitudinal) | ± 0.3 mm (Tolerance compensation when plugged in) |
| Kawasan pematerian permukaan logam (lapisan tengah) | Nickel (Ni) |
| Rintangan penebat, kedudukan bersebelahan | ≥ 5 GΩ |
| Nilai minimum untuk jarak pelepasan dan jarak rayapan | 0.25 mm |
Spesifikasi teknikal dan data prestasi
Panduan pemasangan dan operasi