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CCVA 2,5/ 2-G P26 THR R32
CCVA 2,5/ 2-G P26 THR R32 1107088 PHOENIX CONTACT Housing base printed circuit board, number of poles: 2, pi..
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Spesifikasi Utama
Langkah:5 mm
nota:Complies with WEEE/RoHS, no thread-like materials according to IEC 60068-2-82/JEDEC JESD 201
Keputusan:Test passed
Proses:Reflow/wave soldering
Maklumat Pembekal
Produk: 0
Biasanya dihantar dalam 2-3 hari bekerja
Kualiti Dijamin
Penghantaran Pantas
Sokongan Teknikal
Spesifikasi Teknikal
| Parameter | Nilai |
|---|---|
| Langkah | 5 mm |
| nota | Complies with WEEE/RoHS, no thread-like materials according to IEC 60068-2-82/JEDEC JESD 201 |
| Keputusan | Test passed |
| Proses | Reflow/wave soldering |
| Amplitud | 0.35 mm (10 Hz ... 60.1 Hz) |
| Tahap ESD | (D) Anti-static |
| Kekerapan | 10 - 150 - 10 Hz |
| Pembungkusan | Tape width 32 mm |
| Lebar [l] | 12.8 mm |
| Tinggi [t] | 14.6 mm |
| Panjang [l] | 8.57 mm |
| Susun Atur Pin | Linear Pinning |
| Saiz aci | 1 x 1 mm |
| Kelajuan Sapuan | 1 octave/min |
| Pecutan | 5g (60.1 Hz ... 150 Hz) |
| Warna (Sarung) | Black (9005) |
| Barisan Produk | COMBICON Connectors M |
| Jenis Produk | Basic socket for printed circuit boards |
| Diameter lubang | 1.6 mm |
| Jenis pemasangan | TTHR / wave soldering |
| Ulasan artikel | 01 |
| Lebar tali pinggang [L] | 32 mm |
| Bilangan baris | 1 |
| Keluarga Produk | CCVA 2.5/.. -G |
| Kemasan Permukaan | Galvanic tin plating |
| Bilangan tiang | 2 |
| Arahan Ujian | X, Y, and Z axis |
| Bahan Sentuh | Cu Alloy |
| Voltan AC tetap | 2.21 kV |
| Kerintangan Jisim | 1.2 mΩ |
| Bilangan kitaran | 25 |
| Arus Terkadar IN | 12 A |
| Voltan dinilai PBB | 320 V |
| Diameter gegelung [A] | 330 mm |
| Jenis pembungkusan | Transparent bag |
| Kitaran manuver | 25 |
| Nota untuk Operasi | According to DIN EN 61984, COMBICON connectors are connectors without switchable power (COC). For use in accordance with the intended use, they must not be switched on or disconnected while they are still live or under load. |
| Spesifikasi Ujian | DIN EN 60512-1-1:2003-01 |
| Lukisan Berdimensi | |
| Ketinggian Pemasangan | 12 mm |
| Bahan penebat | LCP |
| Kerintangan Jisim R1 | 1.2 mΩ |
| Kerintangan Jisim R2 | 1.2 mΩ |
| Data Proses Kimpalan | Machining in reflow processes in accordance with IEC 60068-2-58 or DIN EN 61760-1 (updated version)Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C |
| Voltan saiz (II/2) | 400 V |
| Panjang Alur Kimpalan [P] | 2.6 mm |
| Bilangan tiang yang diuji | 24 |
| Voltan saiz (III/2) | 320 V |
| Voltan saiz (III/3) | 250 V |
| Tempoh ujian setiap gandar | 2.5 h |
| Saiz luaran gegelung [W2] | 38.4 mm |
| Kitaran Pematerian Aliran Semula | 3 |
| Tekanan akibat kakisan | 0.2 dm3KNOW2on 300 dm3/40 °C/1 cycle |
| Tahap Sensitif Kelembapan | MSL 1 |
| Kumpulan Bahan Penebat | IIIa |
| CTI mengikut IEC 60112 | 175 |
| Voltan Impuls Terkadar (II/2) | 4 kV |
| Suhu Pengelasan Tc | 260 °C |
| Nilai rayapan minimum (II/2) | 4 mm |
| Voltan impuls dinilai (III/2) | 4 kV |
| Voltan impuls dinilai (III/3) | 4 kV |
| Voltan Impuls Saiz (II/2) | 4 kV |
| Suhu ambien (pemasangan) | -5 °C ... 100 °C |
| Nilai rayapan minimum (III/2) | 3.2 mm |
| Nilai rayapan minimum (III/3) | 4 mm |
| Voltan Pengasingan Terkadar (II/2) | 400 V |
| Voltan Impuls Saiz (III/2) | 4 kV |
| Voltan impuls saiz (III/3) | 4 kV |
| Daya tegangan setiap kutub lebih kurang. | 6 N |
| Suhu ambien (operasi) | -40 °C ... 100 °C (depending on derating curve) |
| Voltan Pengasingan Terkadar (III/2) | 320 V |
| Daya sisipan setiap tiang lebih kurang. | 8 N |
| Voltan penebat yang dinilai (III/3) | 250 V |
| Tekanan akibat kesan haba | 100 °C/168 h |
| Bilangan Pin Kimpalan setiap Potensi | 1 |
| Kawasan Kimpalan Permukaan Logam (Lapisan Tengah) | Nickel (1.3 - 3 μm Ni) |
| Suhu ambien (penyimpanan/pengangkutan) | -40 °C ... 70 °C |
| Kelas kebolehbakaran mengikut UL 94 | V0 |
| Tegangan impuls menegak di atas paras laut | 4.8 kV |
| Kawasan sentuhan permukaan logam (lapisan tengah) | Nickel (1.3 - 3 μm Ni) |
| Kelembapan relatif (pengangkutan dan penyimpanan) | 30 % ... 70 % |
| Kawasan Kimpalan Permukaan Logam (Lapisan Permukaan) | Tin (3 - 5 μm Sn) |
| Zon sentuhan permukaan logam (lapisan permukaan) | Tin (3 - 5 μm Sn) |
| Rintangan Penebat Antara Kutub Bersebelahan | > 5 MΩ |
| Nilai rambat minimum - julat tidak homogen (II/2) | 3 mm |
| Nilai rambat minimum - julat tidak homogen (III/2) | 3 mm |
| Nilai pelepasan minimum - julat tidak homogen (III/3) | 3 mm |
| Bidang aplikasi untuk pemegang kenalanAplikasi >20 N | Test passed |
| Rintangan terhadap arus permukaan (DIN EN 60112 (VDE 0303-11)) | CTI 175 |
Penerangan Produk
Printed circuit board base case, nominal section: 2.5 mm², color: black, nominal current: 12 A, nominal voltage (III/2): 320 V, contact surface: Tin, contact type: Male, number of rows: 1, number of p
Ciri-ciri Utama
- Kualiti gred industri
- Patuh RoHS
- Sijil CE
- Jaminan 1 tahun
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