

| Parameter | Nilai |
|---|---|
| Langkah | 5.08 mm |
| Keputusan | Approved Test |
| Proses | Reflow/Wave Soldering |
| Amplitud | 0.35 mm (10 Hz ... 60.1 Hz) |
| Tahap ESD | (D) Electrostatically conductive |
| Lebar [l] | 40.59 mm |
| kekerapan | 10 - 150 - 10 Hz |
| Tinggi [t] | 14.6 mm |
| Panjang [l] | 8.57 mm |
| Reka Bentuk Pin | Linear Pin Arrangement |
| Jenis Kejutan | Semi-sinusoidal |
| Pemerhatian | WEEE/RoHS compliant, filament-free according to IEC 60068-2-82/JEDEC JESD 201 |
| Kitaran Palam | 25 |
| Kelajuan sapuan | 1 octave/min |
| Pecutan | 5g (60.1 Hz ... 150 Hz) |
| Pembinaan | Suitable component for Through Hole Reflow |
| Barisan Produk | COMBICON Connectors M |
| Jenis Produk | Printed circuit board base housing |
| Diameter lubang | 1.6 mm |
| Ulasan Artikel | 01 |
| Lebar Tali Pinggang [L] | 56 mm |
| Bilangan baris | 1 |
| Ketinggian Keseluruhan | 12 mm |
| Keluarga Produk | CCV 2.5/.. -GF |
| Tekanan haba | 105 °C/168 h |
| Flange pengapit | Overhead clamping (thread) |
| Warna (Perumahan) | Grey (7042) |
| Bilangan tiang | 6 |
| Arahan Ujian | X, Y, and Z axes |
| Bahan sentuh | Cu Alloy |
| Skim Dimensi | |
| Bilangan kitaran | 25 |
| Jenis pemasangan | THR welding/wave welding |
| Diameter Gegelung [A] | 330 mm |
| Keletihan kakisan | 0.2 dm3UNDER2in 300 dm3/40 °C/1 cycle |
| Dimensi Kuil | 1 x 1 mm |
| Tork pengetatan | 0.3 Nm |
| Jenis pembungkusan | 56 mm wide strap |
| Rintangan sentuhan | 1 mΩ |
| Arus Nominal IN | 12 A |
| Voltan nominal UN | 320 V |
| Jenis pembungkusan luar | Dry bag |
| Spesifikasi Ujian | DIN EN 60512-1-1:2003-01 |
| Voltan AC yang boleh ditanggung | 2.21 kV |
| Bahan penebat | LCP |
| Panjang Pin Kimpal [P] | 2.6 mm |
| Bilangan potensi | 6 |
| Rintangan Sentuh R1 | 1 mΩ |
| Rintangan Sentuh R2 | 1 mΩ |
| Tempoh kemalangan | 18 ms |
| Bilangan sambungan | 6 |
| Daya pasang masuk lebih kurang. | 8 N |
| Voltan nominal (II/2) | 400 V |
| Bilangan tiang yang diuji | 12 |
| Voltan saiz (III/3) | 250 V |
| Tempoh ujian setiap paksi | 2.5 h |
| Ciri-ciri Permukaan | Galvanically tinned |
| Tahap Sensitif Kelembapan | MSL 1 |
| Data mengenai Proses Kimpalan | Processing in reflow soldering processes in accordance with IEC 60068-2-58 or DIN EN 61760-1 (current version, respectively)Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C |
| Kumpulan bahan penebat | IIIa |
| Kitaran kimpalan. melalui refluks | 3 |
| CTI mengikut IEC 60112 | 175 |
| Voltan dimensi (III/2) | 320 V |
| Suhu Ambien (Perkhidmatan) | -40 °C ... 105 °C (depending on the rating curve) |
| Suhu Pengelasan Tc | 260 °C |
| Suhu Ambien (Pemasangan) | -5 °C ... 100 °C |
| Pengukuran Gegelung Luaran [W2] | 62.4 mm |
| Voltan sementara nominal (II/2) | 4 kV |
| Voltan Penebat Saiz (II/2) | 400 V |
| Voltan sementara nominal (III/2) | 4 kV |
| Voltan sementara nominal (III/3) | 4 kV |
| Voltan Penebat Saiz (III/2) | 320 V |
| Voltan Penebat Saiz (III/3) | 250 V |
| Nilai garisan rayapan minimum (II/2) | 4 mm |
| Voltan kejutan yang boleh ditanggung di paras laut | 4.8 kV |
| Kawasan kimpalan permukaan logam (lapisan atas) | Tin (3 - 5 μm Sn) |
| Nilai garisan rayapan minimum (III/2) | 3.2 mm |
| Nilai garisan rayapan minimum (III/3) | 4 mm |
| Bilangan Pin Pateri Setiap Potensi | 1 |
| Pemerhatian mengenai operasi | According to DIN EN 61984, COMBICON connectors are connectors without switching power (COC). In the event of use as prescribed, they must not be plugged in or unplugged under voltage or under load. |
| Pemegang Kenalan DigunakanKeperluan >20 N | Approved Test |
| Tiang Bersebelahan Rintangan Penebat | > 5 MΩ |
| Voltan sementara dimensi (II/2) | 4 kV |
| Kelas mudah terbakar mengikut UL 94 | V0 |
| Kuasa apabila dicabut melalui tiang lebih kurang. | 6 N |
| Voltan Sementara Pendimensian (III/2) | 4 kV |
| Voltan sementara dimensi (III/3) | 4 kV |
| Kawasan sentuhan permukaan logam (lapisan atas) | Tin (3 - 5 μm Sn) |
| Suhu Ambien (Penyimpanan/Pengangkutan) | -40 °C ... 70 °C |
| Kawasan Sentuhan Permukaan Logam (Lapisan Tengah) | Nickel (1.3 - 3 μm Ni) |
| Kawasan Kimpalan Permukaan Logam (Lapisan Tengah) | Nickel (1.3 - 3 μm Ni) |
| Kelembapan relatif udara (penyimpanan/pengangkutan) | 30 % ... 70 % |
| Rintangan terhadap arus bocor (DIN EN 60112 (VDE 0303-11)) | CTI 175 |
| Nilai Minimum Jarak Penebat Udara - Medan Tidak Homogen (II/2) | 3 mm |
| Nilai Minimum Jarak Penebat Udara - Medan Tidak Homogen (III/2) | 3 mm |
| nilai minimum jarak penebat udara - medan bukan homogen (III/3) | 3 mm |
Spesifikasi teknikal dan data prestasi
Panduan pemasangan dan operasi